We have expertise, experience and top-of-the line equipment to support all your BGA rework and repair needs.

We offer an array of services including BGA removal, replacement, re-balling, x-ray inspection services, pad repair and mask repair at the BGA sites.

All our BGA services are performed by trained technicians with top-line SRT 1100 rework equipment and Nicolet X-ray system. This system will pin point defects including solder joint shorts, opens and voids.


X-ray services for BGA component and site inspection is completed on every board we process to ensure the highest quality level. We use a Nicolet X-ray system to inspect every BGA reworked. This system will pin point defects including solder joint shorts, opens, and voids.

For more information please call 408-497-1531 or E-Mail sales@biztronic.com

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